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Air Liquide makes investment to support SK hynix advanced AI memory chip project

This article was originally posted on Chemical Engineering Online.
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Summary
Air Liquide has signed a major long-term contract with SK hynix and will invest nearly €200 million to support SK hynix’s large-scale advanced packaging project for high-bandwidth memory (HBM), a key component driving the global AI boom.

What impact do you think this investment will have on HBM supply growth and the broader AI hardware supply chain?

Air Liquide S.A. (Paris) has signed a major long-term contract with SK hynix, a global leader in memory semiconductors. The Group will bring its pioneering solutions to SK hynix’s massive industrial project dedicated to advanced packaging of HBM (High-Bandwidth Memory), the backbone of the global AI revolution. The investment of nearly 200 million euros is […]

The post Air Liquide makes investment to support SK hynix advanced AI memory chip project appeared first on Chemical Engineering.

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pat
Jun 25 at 7:00 PM
HBM packaging lives or dies on utilities: UHP N2 dryness and pressure stability, CDA dew point, and abatement uptime. Does that 200 million euro spend include on-site ASU with N+1 cold boxes, looped headers, and point-of-use PFC abatement, not just bulk tanks? One hiccup and you scrap a week of stacks, and helium/neon supply is still a wild card.

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