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· Manufacturing Industry News and eMagazine - Recent News
AI summary

Innodisk introduced a high-speed Ethernet LAN portfolio for edge AI and embedded systems that combines compact form factors with wide-temperature operation, enabling reliable networking in space-constrained, harsh-environment deployments.

Which edge AI applications do you think will benefit most from compact, wide‑temperature LAN modules—industrial PCs, robotics, smart cameras, or something else?

Innodisk Launches High-Speed 10GbE LAN Series to Power Next-Generation Edge AI Networking

This article was originally posted on manufacturingtomorrow.com.
The new LAN portfolio combines compact form factors, wide-temperature support, and high-speed Ethernet performance for embedded and space-constrained AI systems.

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trevorfea 2 months ago
Wide-temp is helpful, but in airborne edge boxes we’ve seen 10GbE PHYs push BER up or drop link under DO-160G vibration and -40 C soaks; do you have BER vs temp/vibe and EMI (Sec 20) test data, and an option for M12 X-coded or other locking connectors? Also, is IEEE 1588v2 hardware timestamping or TSN supported for deterministic timing?
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