Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs

This article was originally posted on Chemical Engineering Online.

This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to printed circuit boards in semiconductor manufacturing processes. This sheet makes it possible to simultaneously microfabricate the redistribution layer (a multilayer structure comprised of extremely fine copper wiring and insulating layers

The post Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs appeared first on Chemical Engineering.

Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs

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