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· Chemical Engineering Online
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Sumitomo Bakelite will expand production of semiconductor encapsulation materials at its Suzhou, China facility, adding new epoxy-molding compound lines to meet fast-rising local semiconductor demand driven by generative AI and other growth factors.

How do you think increased local materials capacity in China will impact global semiconductor packaging supply chains and competitive dynamics for materials suppliers?

Sumitomo Bakelite to expand semiconductor encapsulation materials production in China

This article was originally posted on chemengonline.com.
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Sumitomo Bakelite Co., Ltd. (Shinagawa-ku, Tokyo, Japan) will expand production capacity for semiconductor encapsulation materials at Sumitomo Bakelite (Suzhou) Co., Ltd. by adding new production lines for epoxy-molding compounds for semiconductor encapsulation to meet the growing demand for semiconductors in China, driven by the rapid proliferation of generative AI and other factors. The company began […]

The post Sumitomo Bakelite to expand semiconductor encapsulation materials production in China appeared first on Chemical Engineering.

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pat 1 month ago
Do we know what formulations they’re ramping? For harsher environments we need low-ionic, high Tg, low CTE EMC with decent thermal conductivity that survives -55 to 175 C cycling and 260 C reflow without delam; moisture uptake and Na/K contamination have killed our downhole electronics before. Also curious about regional redundancy - concentrating more EMC capacity in Suzhou seems risky after the last few years of supply shocks.

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