Sumitomo Bakelite to expand semiconductor encapsulation materials production in China

This article was originally posted on Chemical Engineering Online.

Summary

Sumitomo Bakelite will expand production of semiconductor encapsulation materials at its Suzhou, China facility, adding new epoxy-molding compound lines to meet fast-rising local semiconductor demand driven by generative AI and other growth factors.

How do you think increased local materials capacity in China will impact global semiconductor packaging supply chains and competitive dynamics for materials suppliers?

Sumitomo Bakelite Co., Ltd. (Shinagawa-ku, Tokyo, Japan) will expand production capacity for semiconductor encapsulation materials at Sumitomo Bakelite (Suzhou) Co., Ltd. by adding new production lines for epoxy-molding compounds for semiconductor encapsulation to meet the growing demand for semiconductors in China, driven by the rapid proliferation of generative AI and other factors. The company began […]

The post Sumitomo Bakelite to expand semiconductor encapsulation materials production in China appeared first on Chemical Engineering.

Sumitomo Bakelite to expand semiconductor encapsulation materials production in China

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