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Ultra-low-viscosity material delivers protection for challenging device designs

This article was originally posted on Chemical Engineering Online.
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Summary
Technomelt PA 6370 is an ultra-low melt viscosity, highly flowable polyamide hot-melt for low-pressure molding of intricate electronic components, capable of thoroughly filling 0.5-mm gaps. It meets stringent industry requirements for moisture, heat, corrosion, and environmental resistance to enhance reliability in challenging device designs.

Where in your designs could a low-pressure, ultra-low-viscosity material that fills 0.5-mm gaps most improve protection or manufacturing yield?

Technomelt PA 6370 is a highly flowable, ultra-low melt viscosity low-pressure molding material engineered for the most intricate and challenging electronic systems and components. Capable of thoroughly filling gaps as small as 0.5mm, the new polyamide-based hot melt meets rigorous industry requirements to ensure rugged moisture, heat, corrosion, and environmental resistance, elevating operational reliability.

The post Ultra-low-viscosity material delivers protection for challenging device designs appeared first on Chemical Engineering.

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