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· Manufacturing Industry News and eMagazine - Recent News
AI summary

FANUC America will showcase AI-powered robotics and intelligent packaging automation at PACK EXPO International 2026, with live demonstrations at Booth N25217 spanning package verification, food-grade processing, and integrated packaging-to-palletizing applications.

Which demo—package verification, food-grade processing, integrated packaging, or palletizing—would be most valuable for your operation, and what challenge are you hoping it could solve?

FANUC America Brings AI-Powered Robotics and Intelligent Packaging Automation to PACK EXPO International 2026

This article was originally posted on manufacturingtomorrow.com.
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In Booth N25217, visitors will experience live demonstrations ranging from package verification and food-grade processing to integrated packaging and palletizing applications.

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