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· Chemical Engineering Online
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Sumitomo Chemical’s Korean subsidiary, Dongwoo Fine-Chem, has signed a joint-venture agreement with Samsung Electro-Mechanics to establish a company focused on producing glass core substrates for advanced semiconductor packaging.

What impact could this JV have on the advanced packaging supply chain, and what technical or scaling hurdles do you think are most critical for glass core substrates?

Sumitomo Chemical to establish JV with Samsung Electro-Mechanics for semiconductor materials

This article was originally posted on chemengonline.com.
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Sumitomo Chemical Co. (Tokyo, Japan) announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. (Dongwoo Fine-Chem), has signed a joint venture (JV) agreement with Samsung Electro-Mechanics Co., Ltd. (Suwon, South Korea) to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages. The New […]

The post Sumitomo Chemical to establish JV with Samsung Electro-Mechanics for semiconductor materials appeared first on Chemical Engineering.

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