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· Chemical Engineering Online
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Sumitomo Bakelite will expand production capacity for semiconductor encapsulation materials at its Suzhou (China) and Singapore sites, installing new lines for SUMIKON EME molded underfill (MUF) materials and compression-molding granules to meet rising demand for advanced chip packaging.

What impact do you expect this added capacity to have on lead times and regional competitiveness in advanced semiconductor packaging?

Sumitomo Bakelite to expand encapsulation materials capacity in China, Singapore

This article was originally posted on chemengonline.com.
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Sumitomo Bakelite Co., Ltd. (Shinagawa-ku, Tokyo, Japan) will expand production capacity for encapsulation materials used in advanced semiconductor packages at its sites in Suzhou, China, and Singapore. New production lines will be installed at both sites for SUMIKON™ EME molded underfill (MUF) materials and compression-molding granules. Demand for advanced semiconductors used in applications such as […]

The post Sumitomo Bakelite to expand encapsulation materials capacity in China, Singapore appeared first on Chemical Engineering.

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